Interconnect solutions for AI, industrial and IoT applications

Mouser now offers COM-HPC interconnect solutions from Samtec. Created to meet the COM-HPC standard recently launched by the PCI Industrial Computer Manufacturers Group (PICMG), the company’s COM-HPC products are high-density, high-performance connectivity systems for developing technologies such as AI, machine vision, embedded edge computing, 5G infrastructure and connected vehicles, cybersecurity, industrial automation, IoT and more.

These interconnect solutions are based on Samtec’s AcceleRate HP high-performance arrays, giving design engineers the scalability and enhanced performance for next-gen embedded system design and interface flexibility. Providing paired 400-pin connectors (800 pins total), COM-HPC systems give 32Gbps per channel, 2088Gbps per square inch, and 4096Gbps max aggregate up to 300W (from 11.4V-12.6V), while supporting existing and future interfaces like PCIe 5.0 (32GT/s) and 100Gb Ethernet.

The COM-HPC interconnect solutions are ideal for server and client modules, medical, datacom, IoT, telecom, or other high-speed, high-cycle applications, available in both 5mm and 10mm stack heights and 0.635mm pitch.