Silan 12-inch project, Tongfu Microelectronics advanced packaging and testing project…New progress of these projects in Xiamen

Recently, according to Taiwan Hai.com, Xiamen Haicang’s six key semiconductor industry projects have made the latest progress.

 1

Tongfu Microelectronics Xiamen Haicang Advanced Packaging and Testing Project

· project progress

It has been fired and accepted on September 30, and is currently rectified according to the results of the acceptance

· Project Description

Tongfu Microelectronics Advanced Packaging and Testing Project has a total investment of 7 billion yuan, signed and settled in June 2017, and put into trial production in December 2019. The project plans to build an advanced packaging and testing industrialization base focusing on Bumping, WLCSP, CP, FC, SiP and Group III and V compounds.

The project is implemented in three phases, with a total investment of 2 billion yuan in the first phase, planning to build 20,000 Bumping and CP, and 20,000 WLCSP and SIP (pilot test lines).

  2

Silan Compound Semiconductor Project

· project progress

The work regulations have been changed, and the planning and acceptance will be officially submitted after the changes are completed.

· Project Description

The Silan Advanced Compound Semiconductor project is implemented and operated by Xiamen Silan Ming Gallium Compound Semiconductor Co., Ltd. The total investment of the project is 5 billion yuan to build a 4/6-inch compatible advanced compound semiconductor device production line. The main products include advanced compound devices and high-end LED chips. , The third generation of compound power semiconductor devices.

The project is implemented in two phases, of which the first phase of the project will invest 2 billion yuan, which will be put into operation at the end of 2019, and will reach production in 2021; the second phase of the project will have an investment of 3 billion yuan, which is planned to start in 2021 and reach production in 2024.

 3

Yuntian Wafer Level Packaging Project

· project progress

Plan to file the second fire acceptance application in late October

· Project Description

Xiamen Yuntian Semiconductor Technology Co., Ltd. was established in 2018 and is committed to collaborative design, process research and development, engineering verification and mass production services for semiconductor advanced system integration. According to the “Technology Innovation Board Daily” report, Yuntian Semiconductor currently has a 4,500-square-meter factory and built a 4/6-inch wafer-level three-dimensional packaging platform. Last year, the trial capacity was 3,000 pieces/month.

At the same time, the company is building a 24,000-square-meter plant in the second phase, which is expected to be put into use in Q2 2021. By then, the company will have complete wafer-level packaging and testing and system integration capabilities from 4 inches to 12 inches, with a production capacity of up to 20,000 pieces/month. Recently, Yuntian Semiconductor announced that it has received more than 100 million yuan in Series A financing, and the funds will be used for the production capacity expansion of Yuntian’s first-stage plant and the start-up capital of the second-stage plant.

 4

Silan 12-inch project

· project progress

Strive to start trial production in the fourth quarter of 2020

· Project Description

The Silan 12-inch integrated circuit manufacturing production line project is implemented and operated by Xiamen Silan Jike Microelectronics Co., Ltd. The total investment of the project is 17 billion yuan to build two 12-inch integrated circuit manufacturing production lines with MEMS and power devices as the main products. The first 12-inch production line has a total investment of 7 billion yuan, a process line width of 90 nanometers, and a monthly output of 80,000 pieces.

The project will be implemented in two phases: the first phase has a total investment of 5 billion yuan and will achieve a monthly production capacity of 40,000 pieces, which will be put into production in 2020; the second phase of the project will have a total investment of 2 billion yuan and an additional monthly production capacity of 40,000 pieces; the second production line is expected With a total investment of 10 billion yuan, a 12-inch production line with a process line width of 65 nanometers to 90 nanometers will be built.

5

Jinbai flexible circuit board project

· project progress

Strive to cap the main plant in the fourth quarter of 2020

· Project Description

The Jinbai flexible circuit board project is jointly built by Hong Kong Jinbai Technology Co., Ltd. and Xiamen Semiconductor Investment Group Co., Ltd., with a total investment of 1.3 billion yuan. It is planned to build a flexible circuit board (FPC) production line with a monthly production capacity of 3kk, covering an area About 4.7 hectares, and supporting the construction of integrated circuit module assembly line, the annual output value is expected to exceed 1 billion yuan after completion.

The Xiamen Jinbo project mainly builds a large-scale mass production base with OLED COF and other products. In the short term, it has improved and enhanced my country’s flexible carrier technology level, process and material research and development capabilities, and some application fields and key products have narrowed the gap with Japan, South Korea and China. The technological gap between Taiwan and other international mainstream manufacturers

  6

Haicang Semiconductor Industry Base Project

· project progress

The project is undergoing pile foundation engineering, and 96% of the engineering volume is currently completed

· Project Description

The Haicang Semiconductor Industry Base project covers an area of ​​about 6.83 hectares (102.5 acres). It is planned to build 2 11-story R&D office buildings, 6 6-8m high-standard pilot plants and related supporting auxiliary buildings. The total building The area is about 138,000 square meters.

After completion, it will introduce SIP (system-in-package) public technology platform, advanced packaging and testing, wafer manufacturing, equipment and materials companies to settle in. At present, many companies intend to settle in. It is expected to gather about 40 semiconductor companies and provide employment for about 2,000 people. The annual output value of the park will exceed 5 billion yuan and the tax revenue will be about 160 million yuan.

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